006 high performance, thermally conductive silicon pad

The 3K-500-600 high performance, thermally conductive
silicon pad designed with extremely high thermal
conductivity and coherent winding, its thermal
conductivity in the thermally conductive gap filling
materials is unparalleled.
Features & benefits:
●High compressibility, soft and flexible, designed for
applications in low-stress application environment
Nice thermal conductivity
● Electrical insulation
Meet with the environmental requirements of ROHS and UL

● Natural stickiness

Typical applications:
● Communication hardware equipment
● High-speed hard disk drive equipment
● Automobile engine control mould
● Micro processor, memory chip and graphics processor
● Mobile equipment
Physical properties:

Test item	Test method	Unit	Test value of HCH series
			3K600 value	3K500 value
Color	Visual		Blue/ Laterite	Blue/Yellow
Thickness	ASTM D374	Mm	0.25 to 5.0	0.25 to 5.0
Specific Gravity	ASTM D792	g/cm3	2.85	2.7
Hardness	ASTM D2240	Shore C	30	30
Tensile strength	ASTM D412	kg/cm2	55	55
Continuous Use Temp	EN 344	℃	-40 to 220	-40 to 220
Volume Resistivity	ASTM D257	Ω-cm	3.1*1011	3.1*1011
Breakdown voltage	ASTM D149	KV/mm	>5.0	>5.0
Flame Rating	UL-94		V-0	V-0
Conductivity	ASTM D5470	w/m-k	6.0	5.0