Description
007 thermal conductive silicon pad is high-performance,
thermal conductive gap filling materials, mainly for the
transmission interface between the electronic equipment
and heat sink or product outer coving. Nice stickiness,
flexibility, good compression performance and excellent
heat conductivity are designed for 3K300 series，which
make the products can discharge gas from the electronic
original and heat sink, to achieve fully conforming and
obviously cooling effect. Compared to common thermal
conductive & insulating materials, 3K250 series has certain stickiness which bring great convenience in the product installation processing, not easy to fall off and easy to operate.
Features & benefits:
●High reliability & High thermal conductivity
●High compressibility, soft and flexible
●Natural stickiness, no extra surface frontal adhesives
● Meet with the environmental requirements of ROHS and UL
Typical applications
●Communication equipment ●Mobile equipment
●LED Light ●Video equipment
●Switching power supply ●Networking equipment
●Back light model ●Household appliances
Medical equipment ●PC server/workstations
Application modes:
PCB and heat sink
IC and heat sink or product outer coving
●The filling between IC and similar heatsink cooling materials
thermal conductive gap filling materials, mainly for the
transmission interface between the electronic equipment
and heat sink or product outer coving. Nice stickiness,
flexibility, good compression performance and excellent
heat conductivity are designed for 3K300 series，which
make the products can discharge gas from the electronic
original and heat sink, to achieve fully conforming and
obviously cooling effect. Compared to common thermal
conductive & insulating materials, 3K250 series has certain stickiness which bring great convenience in the product installation processing, not easy to fall off and easy to operate.
Features & benefits:
●High reliability & High thermal conductivity
●High compressibility, soft and flexible
●Natural stickiness, no extra surface frontal adhesives
● Meet with the environmental requirements of ROHS and UL
Typical applications
●Communication equipment ●Mobile equipment
●LED Light ●Video equipment
●Switching power supply ●Networking equipment
●Back light model ●Household appliances
Medical equipment ●PC server/workstations
Application modes:
PCB and heat sink
IC and heat sink or product outer coving
●The filling between IC and similar heatsink cooling materials
| Test item | Test method | Unit | 3K300Test Value |
| Color | Visual | Grey/Black | |
| Thickness | ASTM D374 | Mm | 0.5 to13.0 |
| Specific Gravity | ASTM D792 | g/cm3 | 1.8±0.1 |
| Hardness | ASTM D2240 | Shore C | 18±5 to 40±5 |
| Tensile Strength | ASTM D412 | kg/cm2 | 8 |
| ASTM D412 | Pa | 5.88*10 9 | |
| Continuous Use Temp | EN344 | ℃ | -40 to +220 |
| Volume Resistivity | ASTM D257 | Ω-CM | 1.0*1011 |
| Breakdown Voltage | ASTM D149 | KV/mm | 4 |
| Flame Rating | UL-94 | V-0 | |
| Conductivity | ASTM D5470 | w/m-k | 3.0 |
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