High-performance, thermal conductive silicon pad

Item No.: 009
High-performance, thermal conductive silicon pad
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Description
ZERO-high thermal conductivity silicone pad is a high-performance thermal conductivity interface material and select 100% importing raw materials
to fill the the air between heating device and heat sink or metal base.Its softness and flexibility make it can be used covering a very uneven surface.
Heat transfer from the separation device or the entire PCB conduction to the metal shell or diffusion plate to improve the overall heat dissipation and improve
the efficiency of heating electronic components and service life.

Features & benefits:

●high thermal conductivity, low thermal resistance
● soft and flexible, reducing the interface thermal resistance
● High electrical insulation to protect sensitive electronic devices
● natural sticky, easy assembly, re-workable
● Meet ROHS and UL environmental requirements


Typical applications:

● CPU, memory module
● Communication hardware equipment
● High-speed hard disk drive
● Automotive engine control module
● Microprocessors, memory chips and graphics processors
● Military electronic equipment


 
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