High thermal conductive silicon pad

High thermal conductive silicone pad is a high thermal conductivity Material. The raw material is from Japan Electric Denka (Denka) which made
of high thermal conductivity spherical alumina powder and Dow Corning polymer, which is a cost-effective thermal filler.Natural micro-viscosity and
softness of surface is good for filling the air gap to complete the heat transfer between the heat source and heat sink improving the thermal conductivity
It is very suitable for high performance requirements and is a very good thermal interface materials.

Features & benefits:
● cost-effective, high conductivity, low thermal resistance
● soft and flexible, reducing the interface thermal resistance
● High electrical insulation to protect electronic devices
● natural sticky, easy application, reworkable
● Meet ROHS and UL environmental requirements

Typical applications:
● High thermal conductivity module
● new energy vehicles
●Microprocessors, memory chips and graphics processors
● Network communication equipment
● Car equipment, charger
● High-speed hard disk drive

Parameter
Size: 200mm*400mm, 300mm*400mm; customized size available; fiberglass cloth coated or one-side or dou

Test item	Test method	Unit	LC200 Test value	LC300 Test value	LC400 Test value
Color	Visual		Blue	Grey/Blue	Nattier blue
Thickness	ASTM D374	Mm	0.3~10.0	0.3~10.0	0.3~10.0
Specific Gravity	ASTM D792	g/cm3	3.0	3.1	3.4
Hardness	ASTM D2240	Shore C	20-30	30-40	30-40
Tensile Strength	ASTM D412	kg/cm2	55	55	55
Continuous use Temp	EN344	℃	-40~200	-40~200	-40~200
Volume Resistivity	ASTM D257	Ω-cm	3.1*1011	3.1*1011	3.1*1011
Voltage Endu Ance	ASTM D149	KV/mm	>4.0	>4.0	>3.5
Flame Rating	UL-94		94-V0	94-V0	94-V0
Conductivity	ASTM D5470	w/m-k	2.0	3.0	4.0