Series thermal conductive pad
Item No.: 080
080 Series Thermal Gap Filler is naturally tacky, requiring no adhesive coating to occupy thermal performance, It can also be with a rubber-coated fiberglass carrier becoming one side tacky and no tacky on other side to allowing easy material han
Description
Features
080 Series thermal conductive pad Key Features
-Good thermal conductivity
-High conformability and cost effective
-Shock absorbing and naturally tacky
-Electrically insulating
-it is easy to fill in air gaps between PC board and heat sinks or a metal chassis
Applications
ZERO TSP080 Series thermal conductive pad Applications
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Product Parameter
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