Series thermal conductive pad
Item No.: 600L
Silicone-based thermal pads are becoming an industry standard for thermal management solutions for their durability to withstand high temperatures up to 200°C. AOK offers a wide variety from 1.0 W/m*K up to 5.0 W/m*K. While some may be concerned with the
Description
Features
600 Series thermal conductive pad Key Features
-Thermal Conductivity: 6.0 W/m.k
-High conformability
-Electrically insulating
-Easy to assembly
Applications
600 Series thermal conductive pad Applications
Thermal pads are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Product Parameter
| Properties of TP600 | |||
| Properties | Units | TP600 | Test Method |
| Construction & Composition | --- | Silicone & Ceramic filled | --- |
| Color | --- | orange | Visual |
| Thickness Range | mm | 1.0～10.0 | ASTM D374 |
| Hardness | Shore C | 50±5 | ASTM D2240 |
| Density | g/cc | 3.285 | ASTM D792 |
| Thermal Resistance | ℃-in2/W | 0.138 | ASTM D5470 |
| Elongation | % | 80% | ASTM D412 |
| Continuous Use Temp | ℃ | -40 to 150 | EN344 |
| Breakdown Voltage | Kv/mm | ＞5.0 | ASTM D149 |
| Volume Impedance | Ω.cm | 1012 | ASTM D257 |
| Dielectric Constant | 1MHz | 7.9 | ASTM D150 |
| Weight Daminify | % | ≤ 1.0 | @125℃ 240H |
| Flame Rating | --- | V-0 | UL 94 |
| Thermal Conductivity | W/m.k | 6.0 | ISO 22007-2 |
| UL, RoHS, REACH | --- | Compliance | --- |
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