Series thermal conductive pad

Item No.: 500
Silicone-based thermal pads are becoming an industry standard for thermal management solutions for their durability to withstand high temperatures up to 200°C. AOK offers a wide variety from 1.0 W/m*K up to 5.0 W/m*K. While some may be concerned with the
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Description

Features

500 Series thermal conductive pad Key Features

-Thermal Conductivity: 5.0 W/m.k
-High conformability
-Electrically insulating
-Easy to assembly

Applications

500 Series thermal conductive pad Applications

Thermal pads are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.

Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Product Parameter:

Properties of TP500
Properties Units ZERO TP500 Test Method
Construction & Composition --- Silicone & Ceramic filled ---
Color --- Gray red Visual
Thickness Range mm 0.5~5.0 ---
Hardness Shore C 40 ASTM D2240
Density g/cc 3.5 ASTM D792
Tensile Strength KN/m 1.0 ASTM D412
Elongation % 80% ASTM D412
Continuous Use Temp -40 to 150 EN344
Breakdown Voltage Kv/mm ≥6.0 ASTM D149
Volume Impedance ohm-cm 1.1*1016 ASTM D257
Dielectric Constant 1MHz 6.4 ASTM D150
Weight Daminify --- ≤0.5﹪ @150℃ 240H
Flame Rating --- V-0 UL 94
Thermal Conductivity W/m.k 5.0 ASTM D5470
UL, RoHS, REACH --- Compliance ---
Sheet sizes:
Standard sheet size:200*400mm;Custom Die-cut parts available;Available with or without PSA on reinforced side

 

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