Series thermal conductive pad
Item No.: 700
Thermal pads are used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.
Description
Features
700 Series thermal conductive pad Key Features
-Thermal Conductivity: 7.0 W/m.k
-High conformability
-Electrically insulating
-Easy to assembly
700 Series thermal conductive pad Applications
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink
Product Parameter:
| Properties of ZEROTP700 | |||
| Properties | Units | TP700 | Test Method |
| Construction & Composition | --- | Silicone & Ceramic filled | --- |
| Color | --- | Light blue | Visual |
| Thickness Range | mm | 1.0～10.0 | ASTM D374 |
| Hardness | Shore C | 35±5 | ASTM D2240 |
| Density | g/cc | 3.3 | ASTM D792 |
| Thermal Resistance | ℃-in2/W | 0.13 | ASTM D5470 |
| Specifications | mm | 200×400 | ASTM D1204 |
| Continuous Use Temp | ℃ | -40 ~150 | EN344 |
| Breakdown Voltage | Kv/mm | ＞6.0 | ASTM D149 |
| Volume Impedance | Ω.cm | ASTM D257 | |
| Dielectric Constant | 1MHz | 7.1 | ASTM D150 |
| Weight Daminify | % | ≤ 1.0 | @125℃ 240H |
| Flame Rating | --- | V-0 | UL 94 |
| Thermal Conductivity | W/m.k | 7.0 | ISO 22007-2 |
| UL, RoHS, REACH | --- | Compliance | --- |
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