Series thermal conductive pad
Item No.: 155
155 Series Thermal Gap Filler is naturally tacky, requiring no adhesive coating to occupy thermal performance, It can also be with a rubber-coated fiberglass carrier becoming one side tacky and no tacky on other side to allowing easy material handing
Description
Features
150 Series thermal conductive pad Key Features
-Medium thermal conductivity
-High conformability and cost effective
-Naturally tacky
-Electrically insulating
Applications
150 Series thermal conductive pad Applications
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Product Parameter
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