Series thermal conductive pad
Item No.: 300L
300 Series Thermal Gap Filler is naturally tacky, requiring no adhesive coating to occupy thermal performance, It can also be with a rubber-coated fiberglass carrier becoming one side tacky and no tacky on other side to allowing easy material handi
Description
Features
Series thermal conductive pad Key Features
-High thermal conductivity
-High conformability and cost effective
-Naturally tacky requiring no additional adhesive coating
-Electrically insulating
Applications
Series thermal conductive pad Applications
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
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