Thermal Cap
Item No.: 016
Thermal Cap
●Low thermal contact resistance
●Electrically isolating
●Decrease the weight of the product
●Easy to assemble
●Thermal conduction and buffer effect
●Low thermal contact resistance
●Electrically isolating
●Decrease the weight of the product
●Easy to assemble
●Thermal conduction and buffer effect
Description
Application:
Electronic components: IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, DVD Applications, Hand-set applications etc.
Property table:
Electronic components: IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, DVD Applications, Hand-set applications etc.
Property table:
Relevant
Review