025 Thermal Pad
Item No.: 025
ZERO TSP025 Thermal Pad
●Smooth surface & low contact resistance
●Usable over a wide temperature range
●Electrical insulation; high breakdown voltage
●Complies with UL standards
●Smooth surface & low contact resistance
●Usable over a wide temperature range
●Electrical insulation; high breakdown voltage
●Complies with UL standards
Description
Application:
Electronic components: IC, CPU, MOS,LED
Mother Board, Power Supply, Heat Sink, LCD-TV,
Notebook , PC, Telecom Device, Wireless Hub,
DDR ll Module, DVD Applications, Hand-set Applications etc
Property table:
Electronic components: IC, CPU, MOS,LED
Mother Board, Power Supply, Heat Sink, LCD-TV,
Notebook , PC, Telecom Device, Wireless Hub,
DDR ll Module, DVD Applications, Hand-set Applications etc
Property table:
| Properties | ZERO15 | ZERO20 | ZERO30 | Unit | Tolerance | Test Method | ||||
| Thermal Conductivity |
1.6 |
2.1 |
3.2 |
W / mK |
±10% |
ASTM D5470 |
||||
| Thickness |
0.23 |
0.3 |
0.35 |
mm |
– |
ASTM D374 |
||||
| Color |
Yellow |
Green |
Pink |
– |
– |
Visual |
||||
| Flame Rating |
V-0 |
V-0 |
V-0 |
– |
– |
UL 94 |
||||
| Dielectric Breakdown Voltage (AC) |
4.1 |
4.1 |
3.1 |
KV |
±10% |
ASTM D149 |
||||
| Dielectric Breakdown Voltage (DC) |
6.1 |
6.1 |
5.1 |
KV |
±10% |
ASTM D149 |
||||
| Weight Loss |
<0.2 |
<0.2 |
<0.2 |
% |
– |
ASTM E595 |
||||
| Density |
2.3 |
2.6 |
2.8 |
g / cm3 |
±10% |
ASTM D792 |
||||
| Working Temperature |
-45~180 |
-45~180 |
-45~180 |
°C |
– |
– |
||||
| Volume Resistance |
>1012 |
>1012 |
>1010 |
Ohm-m |
– |
ASTM D257 |
||||
| Elongation |
60 |
60 |
30 |
% |
– |
ASTM D412 |
||||
| Tensile Strength |
200 |
200 |
100 |
Kgf / cm2 |
– |
ASTM D412 |
||||
| Standard Shape |
Sheet ones |
Sheet ones |
Sheet ones |
– |
– |
– |
||||
| Hardness |
Shore A 75 |
Shore A 70 |
Shore A 70 |
– |
±3 |
ASTM D2240 |
||||
 ●REACH ●RoHS ●UL |
||||||||||
| ● Need samples ● Available to apply adhesive ●Pre-cut for different shapes | ||||||||||
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