Thermal Pad
Item No.: 013
013 Ultra Soft Thermal Pad
●Very good thermal conductivity
●High compressibility and compliancy
●Natural tack
●Very good thermal conductivity
●High compressibility and compliancy
●Natural tack
Description
Application:
Best for high power applications
Electronic components: IC, CPU, MOS, LED,
Mother Board,Power Supply,Heat Sink,LCD-TV
Notebook,PC,Telecom Device,Wireless Hub,
DDR ll Module, DVD Applications, Hand-set applications etc.
| roperties | TG-A4500 | Unit | Tolerance | Test Method |
| Thermal Conductivity | 4.5 |
W / mK |
±1.4 |
ASTM D5470 |
| Thickness |
0.5~8.0 |
mm |
– |
ASTM D374 |
|
0.0197~0.315 |
inch |
– |
ASTM D374 |
|
| Color |
Purple |
– |
– |
Visual |
| Flame Rating |
V-0 |
– |
– |
UL 94 |
| Dielectric Breakdown Voltage |
6 |
KV / mm |
- |
ASTM D149 |
| Weight Loss |
<1 |
% |
– |
ASTM E595 |
| Density | 3.1 |
g / cm3 |
±0.2 |
ASTM D792 |
| Working Temperature | -50 ~ +150 | °C | – | – |
| Volume Resistance | 1x1013 | Ohm-m | – | ASTM D257 |
| Elongation |
50 |
% |
– |
ASTM D412 |
| Standard Shape |
Sheet ones |
– |
– |
– |
| Hardnes | 50 |
Shore 00 |
±15 |
ASTM D2240 |
| ●REACH ●RoHS ●UL | ||||
| ● Need samples?●Pre-cut for different shapes | ||||
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